Course Details

Subject {L-T-P / C} : ME6254 : Semiconductor Manufacturing Technology { 3-0-0 / 3}

Subject Nature : Theory

Coordinator : Prof. Susanta Kumar Sahoo

Syllabus

Introduction: Historical Evolution, Present trend, importance, classification, IC manufacturing steps, Microchip, Fundamentals of micro and nano fabrication technologies.
Semiconductor Basics and Device: Semiconductor Materials, Transport and recombination theory, pn and Schottky barrier diodes, bipolar and junction field-effect transistors, and MOS capacitors, ICs and transistors.
Semiconductor Manufacturing Environment: Contamination, its control, Clean rooms, design, Silicon Wafers, preparation, safety requirements, cleaning process, wet chemical etching techniques.
Silicon growth: Silicon crystal structure, Defects, single crystal growth, EGS from MGs, theory, methods, preparation, required properties
Epitaxial growth: Principle, model, methods of deposition, doping and anti-doping, Substrate Engineering, MBE, Defects, Application
Oxidation: Kinetics of Silicon dioxide growth both for thick, thin and ultra-thin films, Oxidation technologies, Thermal Processes, RTP, Characterization of oxide films, Defects.
Thin Film Deposition: Synthesis and properties of various types of inorganic membranes and thin films, sol-gel process, synthesis of porous materials and thin films, Chemical and physical Vapor Deposition and Dielectric Thin Films, Metal Film Deposition: Evaporation and sputtering techniques, Failure mechanisms in metal interconnects, Atomic Layer Deposition (ALD), Deposition of Dielectrics and Semiconductor Layers.
Diffusion: Laws, Diffusivities, systems, Impurity Incorporation, modeling.
Lithography: Photolithography, steps, optical lithography, E-beam lithography and advanced newer lithography techniques and back-end processing, Mask generation, Vapor Prime to Soft Bake, Alignment and Exposure, Photoresist Development.
Etching: classification, type, parameters, Ion beam milling, Doping, Chemical Mechanical Polishing
Ion Implantation: Plasma Basics, Theory, Implanters, annealing, channeling, applications.
Metalization: Single level, Multi-level metallization schemes, wiring the Chip, methods, CMP, CMOS metallization steps, problems
Process Integration: Silicon processing, methods, Passive components, Bipolar Technology, MOSFET Technology, MESFET Technology, fabrication of p-n junction, BJT, CMOS, BiCMOS,
Introduction to MEMs: Types, characteristics, microprocessing, methods, packaging.
Assembling and Packaging: materials, types, die attachment techniques, packaging fabrication techniques, sealing, encapsulation, assembly process, techniques, reliability problems in packaging.
Process monitoring: Assessment of semiconductors by electrical Testing (resistivity, mobility, doping levels), by ion beam techniques (SIMS), and by microscopy and imaging (optical, SEM, TEM, STM, AFM), Micro-chip cooling technologies.

Course Objectives

Course Outcomes

1. Get the theoretical basis for processing of semiconductor devices and integrated circuits. <br />2. Able to do photolithography and simple processing of semiconductors in clean room, and to do characterization with selected techniques. <br />3. Able to present and discuss the theoretical basis for processing and characterization. <br />4. Able to process integrate the all complex activities of semiconductor manufacturing. <br />5. Able to know the advanced technologies on testing and measurements of thin film.

Essential Reading

Supplementary Reading