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R. Sarkar and U. K. Behera, "A study on the phosphate-bonded high-alumina castable —effect of MgO addition", Interceram - International Ceramic Review, vol.67, no.supplement 1, pp.44-49, Springer, September 2018, 10.1007/s42411-018-0041-0 >> Details
A. K. Singh, A. K. Satapathy, and P. Jhunjhunwala, "Numerical analysis of performance of closed-loop pulsating heat pipe", Heat Pipe Science and Technology, An International Journal, vol.5, no.1-4, pp.433-440, Begell House 2014, 10.1615/HeatPipeScieTech.v5.i1-4.490 >> Details
A. Raghav and S. Jayanthu, "NOISE CANCELLATION TECHNIQUES FOR ENHANCING SPEECH COMMUNICATION IN MECHANIZED MINES", in Mining Technology for Sustainabale Development., no.1, pp.64-68, MNTECH Publication 2011 >> Details
S. Muhuri and S. Basu, "Developing residential social cohesion index for high-rise group housing complexes in India", Social Indicators Research, vol.137, no.3, pp.923–947, Springer, June 2018, 10.1007/s11205-017-1633-1 >> Details
P. K. Sharma and D. I. Kim, "Coverage probability of 3D mobile UAV networks", IEEE Wireless Communications Letters, IEEE, July 2018, 10.1109/LWC.2018.2859923 >> Details
P. K. Sharma, P., D., P., and A., "Performance analysis of overlay spectrum sharing in hybrid satellite-terrestrial systems with secondary network selection", IEEE Transactions on Wireless Communications, vol.16, no.10, pp.6586-6601, IEEE, October 2017, 10.1109/TWC.2017.2725950 >> Details
S. Solanki, P. K. Sharma, and P., "Adaptive link utilization in two-way spectrum sharing relay systems under average interference-constraints", IEEE Systems Journal, IEEE, June 2017, 10.1109/JSYST.2017.2713887 >> Details
P. K. Sharma and P., "Performance analysis of cooperative spectrum sharing with multiuser two-way relaying over fading channels", IEEE Transactions on Vehicular Technology, vol.66, no.2, IEEE, April 2016, 10.1109/TVT.2016.2560758 >> Details
P. K. Sharma and P., "Cognitive relaying with transceiver hardware impairments under interference constraints", IEEE Communications Letters, vol.20, no.4, pp.820-823, IEEE, February 2016, 10.1109/LCOMM.2016.2533500 >> Details
K., S. Saha, L. Artola, and P. K. Sahu, "3-D TCAD assessment of fin-based hybrid devices under heavy ion irradiation in 20-nm technology", IEEE Transactions on Device and Materials Reliability, vol.18, no.3, pp.474-480, IEEE, August 2018, 10.1109/TDMR.2018.2865090 >> Details