National Institute of Technology Rourkela

राष्ट्रीय प्रौद्योगिकी संस्थान राउरकेला

ଜାତୀୟ ପ୍ରଯୁକ୍ତି ପ୍ରତିଷ୍ଠାନ ରାଉରକେଲା

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All Publications

Sandhyarani Biswas

Associate Professor
srb@nitrkl.ac.in

M. G, A. Patnaik, S. Biswas, and P. Kumar,"Finite element modeling and development of SiC filled ZA-27 alloy composites in erosive wear environment: A comparative analysis", Proceedings of the Institution of Mechanical Engineers, Part J: Journal of Engineering Tribology, vol.225, pp.1106-1120 2011, 10.1177/1350650111412706       Article
Anu. Gupta, A. Patnaik, A. Kumar, and S. Biswas,"Effect of different parameters on mechanical and erosion wear behavior of bamboo fiber reinforced epoxy composites", International Journal of Polymer Science (Special Issue: Natural Fibers, Bio- and Nanocomposites 2011, 10.1155/2011/592906       Article
S. Biswas and A. Satapathy,"A comparative study on erosion characteristics of red mud filled bamboo-epoxy and glass-epoxy composites", Materials and Design, vol.31, no.4, pp.1752-1767, Elsevier, April 2010, 10.1016/j.matdes.2009.11.021       Article
A. Patnaik, A. Satapathy, N. Chand, N. M. Barkoula, and S. Biswas,"Solid particle erosion wear characteristics of fiber and particulate filled polymer composites: A review", Wear, vol.268, no.1-2, pp.249-263, Elsevier, January 2010, 10.1016/j.wear.2009.07.021       Article
S. Biswas and A. Satapathy,"Tribo-performance analysis of red mud filled glass-epoxy composites using taguchi experimental design", Materials and Design, vol.30, no.8, pp.2841-2853, Elsevier 2009, 10.1016/j.matdes.2009.01.018       Article
S. Biswas and A. Satapathy,"Use of copper slag in glass-epoxy composites for improved wear resistance", Waste Management & Research, vol.28, pp.615-625, Sage, September 2009, 10.1177/0734242X09352260       Article
S. Biswas and S.,"Modified particle swarm optimization for solving machine-loading problems in flexible manufacturing systems", The International Journal of Advanced Manufacturing Technology, vol.39, no.9-10, pp.931-942, Springer 2008, 10.1007/s00170-007-1284-5       Article