National Institute of Technology Rourkela

राष्ट्रीय प्रौद्योगिकी संस्थान राउरकेला

ଜାତୀୟ ପ୍ରଯୁକ୍ତି ପ୍ରତିଷ୍ଠାନ ରାଉରକେଲା

An Institute of National Importance
NIT Rourkela Inside Page Banner

Syllabus

Course Details

Subject {L-T-P / C} : PH6352 : Semiconductor Devices Technology { 3-0-0 / 3}

Subject Nature : Theory

Coordinator : Jyoti Prakash Kar

Syllabus

Module 1 :

Module-1 (3 hours)

Overview of process flow for IC technology, Review of semiconductor device processing technologies, Clean room, Future trends and challenges

Module-2 (6 hours)

Silicon wafer fabrication, Wafer cleaning, Oxidation techniques, Growth kinetics, Oxide growth measurements techniques, Defects in silicon and silicon dioxide, Rapid thermal oxidation

Module-3 (6 hours)

Diffusion and Ion implantation: Basic diffusion process, Dopant solid solubility, Diffusion equation, Error function, Evaluation of diffused layers, Concentration dependent diffusivity, Diffusion profiles, Lateral diffusion, Diffusion, Ficks laws, Sheet resistivity and measurement of dopant profiles, Ion implantation, Ion stopping, Ion channeling

Module-4 (6 hours)

Lithography: resolution, Mask fabrication, Pattern transfer, Optical lithography, Photoresists, X-ray and e-beam lithography

Module-5 (9 hours)

Thin film deposition: Introduction to vacuum systems, Thin film growth (Evaporation, Sputtering, Chemical vapour deposition and Molecular beam epitaxy), Polysilicon, SiO2, Si3N4 and silicide formation, Fabrication of Ohmic and Schottky contacts,

Module-6 (6 hours)

Etching and packaging: Lift-off techniques, Wet and plasma assisted etching techniques, Surface and bulk micromachining, Porous silicon, Encapsulation, Wire bonding, Packaging of semiconductor devices

Course Objective

1 .

Familiarization with clean room facilities and systems used for CMOS processes

2 .

Basic knowledge about the semiconducting materials, devices structures

3 .

To impart knowledge on operating principles of various IC processes

4 .

To learn and optimize unit process of IC fabrication

5 .

To know the current trend and challenges of semiconductor devices

Course Outcome

1 .

At the end of course, students will be able to:
Understand the science of various semiconductor processing

2 .

Know the methodology for synthesis and characterization of electronic materials

3 .

Analyze unit process flow for fabrication of semiconductor devices

4 .

Integrate various technique to get reliable devices

5 .

Develop the technology of various IC fabrication processes

Essential Reading

1 .

J.D. Plummer, M.D. Deal, P.B. Griffin, Silicon VLSI Technology: Fundamentals, Practice, and Modeling, Prentice Hall, 2000

2 .

G.S. May, S.M. Sze, Fundamentals of Semiconductor Fabrication, Wiley, 2003

Supplementary Reading

1 .

S.A. Campbell, The Science and Engineering of Microelectronic Fabrication, Oxford University Press, 2001

2 .

S.K. Ghandhi, VLSI Fabrication Principles: Silicon and Gallium Arsenide, Wiley-Interscience, 1994

Journal and Conferences

1 .

NA