Syllabus

(4 hours)
Introduction: Basics of packaging, Key role of packaging in modern devices, Traditional packaging technology, Requirement of advanced packaging

(5 hours)
Packaging types: Die separation, Hermetic packaging, Plastic packaging, Dual in-line package, Quad flat package, Flip-chip packages, Wafer-level chip scale packages, High density packaging, Surface-mount technology, Pin grid array package, Ball grid array package, Package cracking

(5 hours)
Wire bonding: Types of metal bonding wires and their specifications, Kirkendall effect, Thermocompression technique, Ultrasonic bonding, Thermosonic bonding, Tape automated bonding, Flip chip bonding, Eutectic vs. Adhesive bonding

(7 hours)
Materials used in semiconductor packaging: Polymers- Molding compound, Die attach adhesives, Underfill materials, Organic substrates, Metal- Lead frames, Heat spreaders, and heat sinks, metal wires, Solders, Wafer bumping, Ceramics and glasses Packaging

(8 hours)
Reliability tests: Testing of wire bonding, Visual inspection, Bond etching, Bond pull, Ball shear tests, Package reliability, Preconditioning conditions, Temperature cycling and thermal shock, High-temperature storage life, Temperature-humidity-bias tests, Limitations of reliability testing, Heterogeneous integration, 2D-3D packaging, Package simulations in design, Fan-out wafer level packaging, Packaging of sensor and semiconductor electronics devices, Importance of EMI-EMC shielding and reducing cross-talk, Technology challenges, Future developments

(7 hours)
Flexible packaging: Basic concepts related to flexible electronic encapsulation, Flexible electronic packaging, Flexible substrates, Flexible electronic encapsulation, Test methods, Analysis of flexible electronic packaging, Development of flexible electronics packaging technology

To impart knowledge on the importance of packaging for various electronic devices

Chip encapsulation and packaging technology

Various interconnecting wire-bonding technology

Reliability of semiconductor device packaging

At the end of course, students will be able to understand the science and technology of semiconductor packaging

Develop packaging materials and related process

Learn the wire bonding technology

Test and Analyze the quality of packaging

Get pathway for industry perspective and further studies in packaging

A. Chen, R. S. Lo, Semiconductor Packaging, CRC press , (2012)

G. S. May, S. M. Sze, Fundamentals of Semiconductor Fabrication, John Wiley & Sons Inc. , (2007)

H. Meng, Y. Huang, Flexible Electronic Packaging and Encapsulation Technology, WILEY-VCH GmbH , (2024)

R. R. Tummala, E. J. Rymaszewski, A. G. Klopfenstein, Microelectronics Packaging Handbook, Kluwer Academic Publishers , (1999)

T. M. Moore, R. G. McKenna, Characterization of Integrated Circuit Packaging Materials, Reed Publishing , (1993)