Syllabus

(2 hours)
Introduction: Importance of integrated circuits, Moore’s law, Introduction to microelectronic fabrication, Technology trend of integrated circuits, Basics of layout design.

(5 hours)
Oxidation: Cleanroom, Native oxide on wafers, Dry oxidation, Wet oxidation, Growth kinetics and models, Parameters affecting oxide growth rate, Oxide quality, Oxide thickness, Different methods of oxide growth

(5 hours)
Diffusion: Basic diffusion process, Dopant solid solubility, Diffusion equation, Error function, Evaluation of diffused layers, Concentration dependent diffusivity, Diffusion profiles, Lateral diffusion

(4 hours)
Ion implantation: Generation of ions, Range of implanted ions, Ion channeling, Ion damage, Ion stopping, Conventional annealing, Rapid thermal annealing (RTA), Shallow junction formation, High energy and high current implantation

(5 hours)
Lithography: Basics of photolithography, Photolithography room, Exposure tools, Masks, Photoresists, Pattern transfer, Photo-exposure systems, Contact mode, Proximity mode, Projection mode, Light sources, g-line, i-line, Resolution enhancement, Photoresist baking and developing, Inspection of microstructure and defects, Critical dimension and registration error measurement, Laser writer technique, E-beam lithography, Extreme ultraviolet lithography, X-ray and ion lithography, Next generation lithography

(6 hours)
Growth and Etching: Dielectric, Semiconducting and metallic layer formation, Growth of polysilicon, Formation of silicide, Epitaxial layer, Wet etching, Isotropic and anisotropic etching, Silicon etching, Dielectric etching, Metal etching, Plasma etching, Reactive ion etching (RIE), Lift-off techniques, Porous silicon fabrication

(5 hours)
IC manufacturing: Electrical testing, Die separation, Encapsulation, SOI integration, System on a chip, CMOS process flow for MOSFET and BJT, Quality and Reliability of IC devices, Future trends and challenges

To impart knowledge on various steps of CMOS fabrication

Fabrication of mask for photolithography

Science and technology of various unit steps

CMOS compatible materials

At the end of course, students will be able to understand the CMOS process flow of integrated circuit fabrication

Develop electronic materials and related process

Know the cleanroom and equipment for IC fabrication

Design and fabrication of microelectronic devices

J. D. Plummer, M. D. Deal, P. B. Griffin, Silicon VLSI Technology: Fundamentals Practice and Modeling, Pearson , (2009)

G. S. May, S. M. Sze, Fundamentals of Semiconductor Fabrication, John Wiley & Sons Inc. , (2007)

G. Bose, IC Fabrication Technology, McGraw Hill Education , (2017)

S. A. Campbell, The Science and Engineering of Microelectronic Fabrication, Oxford University Press , (2012)

S. K. Ghandhi, VLSI Fabrication Principles: Silicon and Gallium Arsenide, Wiley , (2008)