National Institute of Technology Rourkela

राष्ट्रीय प्रौद्योगिकी संस्थान राउरकेला

ଜାତୀୟ ପ୍ରଯୁକ୍ତି ପ୍ରତିଷ୍ଠାନ ରାଉରକେଲା

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Syllabus

Course Details

Subject {L-T-P / C} : CH3511 : Microfabrication Techniques { 2-0-0 / 2}

Subject Nature : Theory

Coordinator : Shipra Verma

Syllabus

Module 1 :

Introduction, Basic properties and Lithography
Introduction and scope of the course, Crystal structure and defects, Crystal Growth methods, Wafer fabrication, Basic properties of Silicon wafers, Measurement methods, Relevant models,
Lithography: Introduction, light sources, wafer exposure systems, Photoresists: basic properties and characterization (g-line and i-line), Mask engineering, limits and future trends in technologies and models.

Module 2 :

Thermal Oxidation and Dopant Diffusion
Thermal oxidation and Si/SiO2 interface: Basic concepts, Measurement methods, first order planar growth kinetic model, other relevant models
Dopant Diffusion, Dopant solid solubility, Diffusion from a macroscopic viewpoint, Analytical solution, models and Measurement methods.

Module 3 :

Ion implantation and Thin film deposition
Ion Implantation: Basic concepts, High energy and low energy implants
Thin film deposition: Basic concepts, Physical Vapour Deposition (Evaporation, sputter deposition), Chemical Vapour Deposition (Atmospheric pressure CVD, Low- pressure CVD, Plasma enhanced CVD).

Module 4 :

Etching and area of application
Etching: Wet Etching, Plasma Etching: Basics, Mechanisms, types of plasma etch systems, manufacturing methods, Application based case studies.

Course Objective

1 .

To provide the fundamentals and scope of fabrication at micro level.

2 .

Conveying ideas about various fabrication methods and their processes.

3 .

Describing various kinds of challenges associated at different stages.

4 .

Understanding of different areas of applications and limitations.

Course Outcome

1 .

Know the fundamentals of micro fabrication and its importance.

2 .

Compare the different ways (dry, wet etc.) of etching and fabrication.

3 .

Understand the deposition of various films.

4 .

Analyse the challenges and limitations associated with each method.

5 .

The students can design and modify the micrdevices in different area of applications.

Essential Reading

1 .

Plummer J.D., Deal M.D., Griffin. P.D., Silicon VLSI technology fundamentals, practice, and modelling, Prentice Hall (2000)

2 .

Madou M, Fundamentals of Microfabrication, CRC

Supplementary Reading

1 .

Masliyah J.H., Bhattacharjee S., Electrokinetic And Colloid Transport Phenomena, John Wiley & Sons, INC.

Journal and Conferences

1 .