Syllabus

Module 1: X-ray diffraction and analysis: Production and properties of X-rays, X-ray diffraction, Structure factor and intensity calculations. Determination of crystal structure, Calculation of crystal size and lattice strain using XRD peak broadening, Indexing of XRD spectra. Quantitative phase analysis using XRD. 15 Hours
Module 2: Optical Microscopy, understanding of image formation, resolution, numerical aperture, magnification, depth of field and depth of focus of a microscope. SEM and FESEM: Principle and applications, Modes of operation, Image formation - plane and fractured surfaces. Microanalysis (EDX, WDS etc.) TEM: Principle and operation. Bright field and dark field images, Sample preparation techniques. Selected area diffraction, Reciprocal lattice and Ewald sphere construction, Indexing of selected area diffraction patterns. Advanced Characterization Techniques: STEM, AFM, Nanoindentation Testing, EELS- Principle and applications. 15 Hours
Module 3: Thermal analysis: basics and principles of thermal analysis, DTA/DSC-TG: Scope and applications in materials science. 5 Hours

To have an idea about qualitative and quantitative phase analysis of materials

To have an idea about microstructural characterization of materials

To gain knowledge on thermal characterization of materials

To obtain knowledge about structure-property correlation

CO1: To have an idea of X-Ray diffraction as a materials characterization technique
CO2: To learn qualitative, quantitative phase analysis, crystal structure determination, grain size and strain calculation using XRD
CO3: To learn about basic principles and applications of optical and electron microscopy
CO4: To have an idea of elemental chemical composition analysis using EDS and WDS
CO5: To learn various sample preparation techniques of SEM and TEM
CO6: To gain knowledge of thermal analysis techniques

B.D. Cullity & S.R. Stock, Elements of X-Ray Diffraction, Pearson

P.J. Goodhew, . J. Humphreys, R. Beanland, Electron Microscopy & Analysis, Taylor & Francis

Robert F. Speyer, Thermal Analysis of Materials, Marcel Dekker Inc.

David B. Williams and C. Barry Carter, Transmission Electron Microscopy, Springer