National Institute of Technology Rourkela

राष्ट्रीय प्रौद्योगिकी संस्थान राउरकेला

ଜାତୀୟ ପ୍ରଯୁକ୍ତି ପ୍ରତିଷ୍ଠାନ ରାଉରକେଲା

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Syllabus

Course Details

Subject {L-T-P / C} : EC3203 : Electronic System Design { 2-0-0 / 2}

Subject Nature : Theory

Coordinator : Sudip Kundu

Syllabus

Module 1 :

Introduction to Electronic System Design
• Definition and classification of electronic systems (analog, digital, mixed-signal, embedded),
• Hierarchical design methodology: Top-down vs. bottom-up,
• System-level design flow and abstraction levels (behavioral, RTL, gate level, transistor level),
• Circuit Design Approach: Simulation - behavioral, RTL, gate level, transistor level, AC, DC, Transient, Hardware - Breadboard, veroboard, PCB, FPGA,
• Circuit simulation tools: LTspice, Multisim, Proteus
• Functional and timing simulation
• Case studies: Simple embedded systems, consumer electronics.

Module 2 :

Design with Analog and Digital Subsystems
• Interfacing analog and digital blocks
• Types of sensors: temperature, pressure, proximity, IR, ultrasonic Signal conditioning circuits (filters, amplifiers, converters)
• Sampling, quantization, and ADC/DAC concepts
• A/D and D/A converter integration and design considerations
• Clock generation and synchronization
• Understanding of specification and selection of components: resistor, capacitor, inductor, ICs: Amplifiers, ADCs/DACs, Embedded Hardware, FPGA, Sensors.
• Interfacing sensors with microcontrollers
• Motor drivers and actuators (DC, stepper, servo)
• Power management block

Module 3 :

Embedded System Components
• Microcontrollers / Microprocessors architecture
• Selection of Microcontrollers / Microprocessors
• Memory interfacing (EEPROM, Flash, SRAM)
• Communication Interfaces: UART, SPI, I2C, RS-232, USB, CAN, Bluetooth, Zigbee, Wi-Fi,
• Serial vs. parallel communication
• Power supply and regulation

Module 4 :

PCB Design and Layout
• Schematic design and simulation tools (e.g., KiCad, Eagle, Altium)
• PCB layout guidelines
o Grounding and decoupling
o Trace routing
o Thermal management
• Fabrication and assembly overview

Course Objective

1 .

Students will be able to describe analog, digital, mixed-signal, and embedded systems, and differentiate between hierarchical design approaches like top-down and bottom-up.

2 .

Students will design basic interfacing circuits, implement ADC/DAC integration, and select appropriate analog/digital components and signal conditioning methods.

3 .

Students will interface various sensors and actuators with microcontrollers, considering real-world applications like consumer electronics and control systems.

4 .

Students will analyze architectural differences of microcontrollers/microprocessors, choose appropriate ones for design needs, and integrate communication protocols.

5 .

Students will be able to design printed circuit boards ensuring proper grounding, trace routing, and thermal considerations for reliable system performance.

Course Outcome

1 .

Understand and classify different types of electronic systems and design methodologies.

2 .

Design and integrate analog and digital subsystems including ADC/DAC and signal conditioning circuits.

3 .

Interface sensors, actuators, and embedded components for specific application-based system design.

4 .

Evaluate and select embedded system components including microcontrollers, memory, and communication interfaces.

5 .

Apply PCB design principles to create schematic and layout designs.

Essential Reading

1 .

Louis E. Frenzel, Contemporary Electronics: Fundamentals, Devices, Circuits, and Systems, McGraw-Hill Education

2 .

Paul Horowitz & Winfield Hill, The Art of Electronics (3rd Edition), Cambridge University Press

3 .

Kraig Mitzner, Complete PCB Design Using OrCAD Capture and PCB Editor, 2nd Edition, Elsevier/Newnes

Supplementary Reading

1 .

Frank Vahid & Tony D. Givargis, Embedded System Design: A Unified Hardware / Software Introduction, John Wiley & Sons

Journal and Conferences

1 .

IEEE Transactions on Consumer Electronics: Link: https://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=30