Module I [7 h]: •Introduction-History of MEMS, Intrinsic Characteristics of MEMS- Miniaturization, and Silicon based MEMS processes, New Materials properties, Silicon as a MEMS material – mechanical properties of silicon. Mechanical components in MEMS, basics of microtechnology-definitions and terminology.
Fabrication technologies – Photolithography – Ion implantation – diffusion – oxidation – CVD – Physical Vapor Deposition – Etching.
Module II [7 h]: Micro manufacturing – Bulk and surface micro machining – LIGA.
• MEMS foundries: MUMPs, CMOS MEMS.
Module III [7 h]: • Electrostatic actuators: cantilevers, comb drives. • Thermal sensing and actuation: chevron actuator”, “heat actuator”, biomimetic cilia.
Piezoresistive Sensors: Piezoresistive Sensor Materials, Stress Analysis of Mechanical Elements, Applications of Piezoresistive Sensors. Piezoelectric Sensing and Actuation: Introduction, Properties of Piezoelectric Materials, Applications.
Module IV [7 h]: • Magnetic actuation: magnetic fields, Lorentz force, micro-coils, magnetic actuators.
• Scaling laws – Scaling in geometry, rigid body dynamics, electrostatic forces, electromagnetic forces, electricity-fluid mechanics and heat transfer.
Module V [8 h]: • Polymer MEMS: Introduction, Polymers in MEMS-Polyimide, SU-8, Liquid Crystal Polymer (LCP), PDMS, PMMA, Parylene, Fluorocarbon, Representative Applications-Acceleration Sensors, Pressure Sensors, Flow Sensors, Tactile Sensors. Optical MEMS: Passive MEMS Optical Components-Lenses, Mirrors, MOEMS components digital mirror display (DMD) grating light valve (GLV), optical scanners.
• MEMS Design – Design considerations – Process design – Mechanical Design – CAD – Micro system packaging – Levels – Bonding – Interfaces – Assembly – Selection of Packaging, Materials for packaging, Cleanroom technology.

To explore the world of microelectromechanical devices and systems (“MEMS”)

To know the materials used and their properties, fabrication technologies, basic structural mechanics, sensing and actuation principles.

To get acquainted with the circuit and system issues, packaging, calibration, and testing.

Understand design and fabrication processes involved with MEMS devices

CO1 Realize the operation of micro devices, micro systems and their applications.
CO2 Able to decide which micromachining technique, such as bulk micromachining and surface micromachining can be used for a specific MEMS fabrication process.
CO3 Able to design the micro devices, micro systems using the MEMS fabrication process.
CO4 Able to analyze the MEMS devices and to develop suitable mathematical models.
CO5 Able to apply scaling laws that are used extensively in the conceptual design of micro devices and systems.

Tai-Ran Hsu, MEMS and Micro systems: Design, Manufacture and Nanoscale Engineering, Wily , 2020

Marc J Madou, undamentals of Microfabrication’, CRC , 2021

Mohamed Gad-el-Hak, The MEMS Handbook, CRC , 2020

Tai Ran Hsu, MEMS & Micro systems Design and Manufacture, TMH , 2023